SUNSHINE T12A-X3 Soldering Station Kit Motherboard Repair Tool for iPhone11 pro X XS MAX Mobile Phone CPU NAND Heating Disassembly Platform

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  • Suitable for IP X/XS/XS MAX motherboard repair heating dismantling , CPU and other components to heat the glue
  • Silicone insulation, high temperature resistance, lowering the temperature of the bottom contact surface.
  • High-purity copper is used as the film to ensure uniform heat transfer and heat.

2,500.00

Out of stock

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