No products in the cart.
AMAOE QU-3 POWER IC BGA REWORK REBALLING STENCILS
MODEL NUMBERS SUPPORTED ;
1 : MSM7225A
2 : MSM8928 B
3 : MSM8940
4 : SDM660
5 : MSM8909
6 : MSM8928 A
7 : MSM8952
8 : MSM8612
| Weight | .1 kg |
|---|
Based on 0 reviews
Be the first to review “RELIFE STENCIL QU: 3”
You must be logged in to post a review.
Related products
-
IPHONE SPECIAL TOOLS, STENCILS
GSM-SOURCES-Iphone7-7P-STENCIL-228×228
- IPHONE 7-7P STENCIL
- All Series BGA Reballing Stencil dedicate kit for IP 4, 4s, 5, 5s, 6, 6s, 6sp, 7, 7P, IP / PAD BGA IC Chip BGA Reballing Stencil Kits Solder template, BGA Stencil of Solder Mask Ink repair Paint-shedding on BGA CHIP
SKU: stencil5 -
MECHANIC, STENCILS
MECHANIC High-end BGA Steel Stencil A8
MECHANIC master-crafted BGA steel stencils, adopted the latest scientific CNC high-speed technology in the working process, which has more accurate solder joint holes than the stencils made by the traditional laser or electroforming process. And its more easier to apart the stencils and the chip, which help you improve your working efficiency and ensure the welding effect.
SKU: n/a -
MECHANIC, STENCILS
MECHANIC High-end BGA Steel Stencil A9
MECHANIC master-crafted BGA steel stencils, adopted the latest scientific CNC high-speed technology in the working process, which has more accurate solder joint holes than the stencils made by the traditional laser or electroforming process. And its more easier to apart the stencils and the chip, which help you improve your working efficiency and ensure the welding effect.
SKU: n/a
There are no reviews yet.