RELIFE RL-044 QU9 Stencil

These stencils are used for aligning the BGA spheres on the chip during the reballing process.

Withstands heat up to 240°C, which is enough for tin alloys to melt, even lead-free alloys that have a melting point around 220°C.

Leaded stranger alloys have a melting point of 183°C.

The larger the stencil, the greater the possibility of it bending. When reballing Chipsets larger than 3cm we recommend maximum caution with the temperature used.

Avoid thermal shocks by gradually increasing the temperature and moving your blower nozzle continuously.

Characteristics:

Model: QU8

Manufacturer: Amaoe

Compatible:

SM8250 – 102

SM8250 – 002

SDN439

SM8250 – 102 RAM

SM8350 RAM

SM8250 – 002 RAM

SM8350 / 888