Mechanic S-60 BGA-IC
- BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
- The ingredients of it is environmental protection and safest. It has good permeability
- it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
- It does not to harm to circuit board and component, even to maintenance worker.