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Mechanic S-60 BGA-IC


  • BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
  • The ingredients of it is environmental protection and safest. It has good permeability
  • it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
  • It does not to harm to circuit board and component, even to maintenance worker.

605.00 660.00

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