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Mechanical Portable Degumming Brush for Mobile Phone Motherboard, IC CPU Chip, Glue Removal, /Pig Mane
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MECHANIC master-crafted BGA steel stencils, adopted the latest scientific CNC high-speed technology in the working process, which has more accurate solder joint holes than the stencils made by the traditional laser or electroforming process. And its more easier to apart the stencils and the chip, which help you improve your working efficiency and ensure the welding effect.
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