- MECHANIC, SOLDERING RELATED PRODUCTS
MECHANIC RX08Rated 0 out of 5(0)
- It is suitable for most domestic mobile phone models
- It is suitable for IP Xr/Xs/X/8/8P frame
- It has a remarkable effect, and a small amount can be effective.
- It does not hurt the cable, does not hurt the LCD, does not hurt the frame
- Just a little bit, you can fix most of your cleaning problems.
Mechanic S-60 BGA-ICRated 0 out of 5(0)
- BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
- The ingredients of it is environmental protection and safest. It has good permeability
- it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
- It does not to harm to circuit board and component, even to maintenance worker.