AMAOE IP4IN1 PCB BGA PLATFORM

AMAOE IP14 Middle Frame Reballing Platform
For iPhone 14 Series
Description
Amaoe iPhone 14 series 4 in 1 Motherboard Mid-Frame BGA Reballing Stencil
Positioning Platform For iPhone 14/14 Plus/14 Pro/14 Pro Max Middle Layer Tin Planting
Reballing Repair. Amaoe IPI4 4-in-1 middle layer reballing platform for iPhone 14 series.
Features:
1. Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no deviation, high-temperature magnetism unchanged.
2. 4 in 1 middle layer tin planting. Precise positioning, fast tin planting.
3. Strong magnetic adsorption, precision hole pitch design.
4. Round and square precise holes, make the tin balls more rounded and prevent the mesh from getting stuck in the tin balls.
Option:
– 0.12mm iPhone 14 4 in 1 Middle Stencil
– 0.12mm iPhone 14 4 in 1 Positioning Plate
– 0.12mm iPhone 14/ 14 Plus Middle Stencil
– 0.12mm iPhone 14 Pro/14 Pro Max Middle Stencil
– Universal bases (with Tin Scraping Blade)