A Zero-halogen Lead-free Solder Paste Specially Developed For Chip Repair And Soldering
Wide Application, Suitable For Nano-chip, Mobile Phone Pcb, Electronic Components, Smt Repair, BGA Chip Planting Ball Welding.
Using High Barrier Material, Anti-layering, No Oil Leakage
It Is Made Of Imported Special Materials, After Repeated Grinding And Refining
No-clean, Strong Diffusion, And Wettability
Efficient Rework To Solve The Chip Welding Problems Such As Black Screen Crash, Unstable Performance, Automatic Restart Of False Welding And False Welding
When In Use, There Is No Smoky Smell, No Residue, No Corrosion, High Activity, Full And Bright Solder Joints
Packaging upgrade, using high barrier material, antistratification, no oil leakage
The new formula, imported special materials, lead-free environmental protection
No cleaning,anti-oxidation, wettability, no residue
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