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Reballing stencil kit for tin planting A8 – A16 CPU, iPhone 6 series to iPhone 13 series.
Built-in high temperature magnet, strong magnetic adsorption, precise positioning and no offset.
High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls.
| Weight | 0.16 kg |
|---|
Relife RL-601MA iPhone CPU Lower Layer Tin Planting Platform Set for iPhone 6 to 14Pro Max A8 to A16. RELIFE RL-601MA 9 in 1 Universal CPU Reballing Stencil Platform For iPhone 6 to 14Pro Max A8/A9/A10/A12/A13/A14/A15/A16 IC Chip Planting Tin Template Fix.
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- Imported rosin from Japan, environmentally , lead-free and halogen-free, with high safety.
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- High insulation resistance, suitable for mobile phone motherboards, cpu repair, etc.
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