No products in the cart.
Based on 0 reviews
Be the first to review “MEGA IDEA BZ 23 QUALCOMM SNAPDRAGON 845/EXYNOS 9810 CPU FOR SAMSUNG S9/S9+ SERIES”
You must be logged in to post a review.
Related products
-
IPHONE SPECIAL TOOLS, STENCILS
GSM-SOURCES-Iphone-6-6+-STENCIL-228×228
- IPHONE 6-6P STENCIL
- BGA Reballing Stencil for ALL KINDS OF BGA CHIP
- All Series BGA Reballing Stencil dedicate kit for IP 4, 4s, 5, 5s, 6, 6s, 6sp, 7, 7P, IP / PAD BGA IC Chip BGA Reballing Stencil Kits Solder template, BGA Stencil of Solder Mask Ink repair Paint-shedding on BGA CHIP
SKU: stencil3 -
STENCILS
GSM-SOURCES UNIVERSAL STENCIL
- BGA Reballing Stencil for ALL KINDS OF BGA CHIP
- All series BGA Reballing Stencil dedicate kit for IP 4, 4s, 5, 5s, 5c, 6, 6p, 6S, 6sp, 7, 7P, IP/PAD BGA IC Chip BGA Reballing Stencil Kits Solder template, BGA Stencil of Solder Mask Ink repair Paint-shedding on BGA CHIP.
SKU: n/a
There are no reviews yet.