RELIFE RL-044
Super accurate: Original data + physical comparison

Super complete: As many as 41 different chips

Very good: Special chip half engraving and engraving process

Precision BGA Stencil
1. Pioneering half etching process, let some components fit into the groove
Protect components to avoid burns.
2. Cooling hole patented design, rapid heat dissipation to avoid damage to components due to excessive temperature.
3. Ultra-precise round square hole positioning, the precision of hole, Round square hole design, Easy to take off the steel, Make the operation more smooth.
4. Double blister packaging, hard paper package, protect the steel mesh from being crushed and deformed during transportation.