In Stock
Chip Adhesive 10CC
Reliable protection for mobile repair professionals
Moisture & Dust Protection • High-Strength Bonding • Fast Curing
₹165.00
Soldering Items, Paste & Flux & Glue
Relife
Description
Applicable to hard disk sealing, CPU sealing, screen IC sealing, etc.
.Effectively prevents the penetration of moisture and dust, providing reliable protection for the bonded object
.Strong durability, high-strength bonding,High temperature resistance
.Can achieve fast curing and provide long-lasting protection for mobile phones
https://ibb.co/LvPMPrX
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