special used for bga ica

Features:

1. 
   

   Fine narrow opening design

   
   


2. 
   

   Transparent and Non-corrosive Layout

   
   


3. 
   

   Cleaning-free,easy to solder,no residue,high insulation resistance

   
   


4. 
   

   Meet different fluxing needs such as motherboard repair,solder thief repair,component soldering and desoldering repair,etc.