The solder paste with a melting point of 183 degrees is called low temperature lead-free solder paste, and its alloy composition is SnBi. When the components of the patch can not withstand temperatures above 183 C, the solder paste is welded with low temperature solder paste. To protect against high temperature.
Volume: 50 g/ bottle
Temperature: 138°C/183°C/217°C (S260/S600/S360)
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
Features:
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection