Effectively prevent the motherboard from being deformed by heat.
The shaft is faster and smoother.
Applicable to all kinds of mobile phone motherboard.
Repair fixed dot matrix face/CPU/hard disk and other IC type glue removal.
Effectively prevent the motherboard from being deformed by heat.
The shaft is faster and smoother.
Applicable to all kinds of mobile phone motherboard.
Repair fixed dot matrix face/CPU/hard disk and other IC type glue removal.
Weight | 0.8 kg |
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