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RELIFE
RELIFE RL-402 183°C Medium Temperature No-Clean Solder Paste Flux RL-402 SolderTin Sn63/Pb67 BGA Reballing Soldering tin
- RELIFE No-clean Soldering Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste for iphone mobile phone BGA Reballing Soldering
- RELIFE Solder Paste Flux-RL-400 RL-401 RL-402 183°C Solder Tin Sn63/Pb67 20-38um, RELIFE Solder Paste, Unique manufacturing of solder past technology, giving a new definition of tin-base technology
- RELIFE No-clean Soldering Paste RL-402 Sn63/Pb67 183°C Solder Paste
- 183°C Solder paste with high quality
- Solder wicking is strong
- Less residual
- No clean
₹220.00
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