RELIFE RL-402 183°C Medium Temperature No-Clean Solder Paste Flux RL-402 SolderTin Sn63/Pb67 BGA Reballing Soldering tin


  • RELIFE No-clean Soldering Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste for iphone mobile phone BGA Reballing Soldering 
  • RELIFE Solder Paste Flux-RL-400 RL-401 RL-402 183°C Solder Tin Sn63/Pb67 20-38um, RELIFE Solder Paste, Unique manufacturing of solder past technology, giving a new definition of tin-base technology
  • RELIFE No-clean Soldering Paste RL-402 Sn63/Pb67 183°C Solder Paste
  • 183°C Solder paste with high quality
  • Solder wicking is strong
  • Less residual
  • No clean

165.00

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