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MECHANIC
Mechanic S-60 BGA-IC
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Out of stock
- BGA IC Adhesive removing liquid softens and removes resinating and sealing glue of chip BGA IC of mobile phones.
- The ingredients of it is environmental protection and safest. It has good permeability
- it can quickly soften and loosens solidified resin adhesive such as phenolics, epoxy, acrylate, polyurethane, organosilicon.
- It does not to harm to circuit board and component, even to maintenance worker.
₹605.00 ₹660.00
Out of stock
Compare| Weight | 0.06 kg |
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