No products in the cart.
Relife Stencil QU4
QUALCOMM CPU
MSM8994B
MSM8974B
MSM8960B
MSM8994A
MSM8974A
MSM8960A
| Weight | 0.1 kg |
|---|
Based on 0 reviews
Be the first to review “Relife Qualcomm CPU-QU4”
You must be logged in to post a review.
Related products
-
IPHONE SPECIAL TOOLS, STENCILS
GSM-SOURCES-IPHONE-6S-6S+-STENCIL-228×228
- IPHONE 6S-6SP STENCIL
- BGA Reballing Stencil for ALL KINDS OF BGA CHIP
- All Series BGA Reballing Stencil dedicate kit for IP 4, 4s, 5, 5s, 6, 6s, 6sp, 7, 7P, IP / PAD BGA IC Chip BGA Reballing Stencil Kits Solder template, BGA Stencil of Solder Mask Ink repair Paint-shedding on BGA CHIP
SKU: stencil4 -
IPHONE SPECIAL TOOLS, MECHANIC, STENCILS
MECHANIC High-end BGA Steel Stencil Iphone7
MECHANIC master-crafted BGA steel stencils, adopted the latest scientific CNC high-speed technology in the working process, which has more accurate solder joint holes than the stencils made by the traditional laser or electroforming process. And its more easier to apart the stencils and the chip, which help you improve your working efficiency and ensure the welding effect.
SKU: n/a
There are no reviews yet.