-
×
Relife Stencil IP 11/Pro/Max-A13 T:0.13
1 × ₹275.00
Subtotal: ₹275.00
Relife QU1
MSM8996A,MSM8996B
MSM8976A,MSM8976B
MSM8992A,MSM8992B
| Weight | 0.1 kg |
|---|
Based on 0 reviews
Be the first to review “RELIFE Qualcomm CPU-QU1”
You must be logged in to post a review.
Related products
-
IPHONE SPECIAL TOOLS, STENCILS
GSM-SOURCES-IPHONE-6S-6S+-STENCIL-228×228
- IPHONE 6S-6SP STENCIL
- BGA Reballing Stencil for ALL KINDS OF BGA CHIP
- All Series BGA Reballing Stencil dedicate kit for IP 4, 4s, 5, 5s, 6, 6s, 6sp, 7, 7P, IP / PAD BGA IC Chip BGA Reballing Stencil Kits Solder template, BGA Stencil of Solder Mask Ink repair Paint-shedding on BGA CHIP
SKU: stencil4 -
MECHANIC, STENCILS
MECHANIC High-end BGA Steel Stencil A10
MECHANIC master-crafted BGA steel stencils, adopted the latest scientific CNC high-speed technology in the working process, which has more accurate solder joint holes than the stencils made by the traditional laser or electroforming process. And its more easier to apart the stencils and the chip, which help you improve your working efficiency and ensure the welding effect.
SKU: n/a -
IPHONE SPECIAL TOOLS, STENCILS
GSM-SOURCES-Iphone-6-6+-STENCIL-228×228
- IPHONE 6-6P STENCIL
- BGA Reballing Stencil for ALL KINDS OF BGA CHIP
- All Series BGA Reballing Stencil dedicate kit for IP 4, 4s, 5, 5s, 6, 6s, 6sp, 7, 7P, IP / PAD BGA IC Chip BGA Reballing Stencil Kits Solder template, BGA Stencil of Solder Mask Ink repair Paint-shedding on BGA CHIP
SKU: stencil3
There are no reviews yet.